The fully automated power module encapsulation system is the core process equipment in the production of encapsulated power modules. Zhuocheng's encapsulation system integrates automatic loading and unloading of wafers and epoxy resin, precise arrangement, efficient preheating, precision molding, automatic cleaning, and sprue cutting into one unit. The mold is equipped with built-in adaptive movable pins and a vacuum pumping system, as well as a fully automated film covering system, ensuring uniform heating and flawless molding of the products. With its compact structure, high efficiency, and stability, the system allows for flexible configuration of the number of presses to meet diverse production needs.